Through Hole Technologies

Two assembly sites are used for through-hole components mounting: manual assembling with cored wire and hand soldering station using, and selective soldering site which is equipped with two selective soldering machines manufactured by EBSO (Germany). Maximum PCB size which can be used in selective soldering machine is 300x300mm. The main advantages of selective soldering technology are:

• local influence on the component's outputs, which doesn't lead to overheat of the whole PCB and allow to decrease reject rate volume comparing to the other traditional mass soldering technologies of the through-hole components.
• Selective soldering technology doesn't impose almost any restrictions on components positional relationship of surface and through-hole mounting on the PCB.
• Soldering in accordance to previously installed program allows to avoid mechanical rejects which can be done by assembly worker.
• Soldering is made in inert gas (nitrogen) medium, which can significantly reduce the oxidation of the solder joint, thereby increasing its reliability.

Solder materials of Alpha Metals company are used for through-hole components selective soldering.